[DC.COMPUTER] Layer 11 · Programmatic Q&A · 8 matches

Which datacenters host AI chip fabrication or HBM packaging?

[AI Summary]

Semiconductor fabs and packaging sites in the AI supply chain — TSMC, Samsung, SK hynix, Micron, Intel.

8
Matching datacenters
4,750 MW
Combined IT
5
Operators
[Facilities · 8]
FacilityOperatorLocationGPUMWPUE
TSMC Fab 18 (Tainan)TSMCTainan, TaiwanN3/N3E (Blackwell, MI300)7001.40
TSMC Arizona Fab 21TSMCPhoenix, AZ, USAN4/N3 (AI accelerators)5001.35
TSMC JASM KumamotoTSMC/SonyKikuyo, JapanN22/N12 (auto/edge AI)4001.42
Samsung Pyeongtaek P3SamsungPyeongtaek, South KoreaHBM3E/HBM49001.40
SK hynix M16 IcheonSK hynixIcheon, South KoreaHBM3E/HBM47001.38
SK hynix IndianaSK hynixWest Lafayette, IN, USAHBM packaging3001.34
Micron Boise HQ FabMicronBoise, ID, USAHBM3E2501.36
Micron Clay (planned)MicronClay, NY, USADRAM/HBM (planned)10001.35
[Knowledge Graph]

Company → Datacenter → GPU → Customer → Industry

Every entity on this site is cross-linked. Follow the graph from operators down to specific facilities, GPU clusters, customers, and sectoral context.